Title :
60 GHz beamforming using in-package bondwire antenna array
Author :
Jeong, Y.S. ; Kang, Min Kyu ; Kim, Tae Wook
Author_Institution :
Dept. of Electr. & Electron. Eng., Yonsei Univ., Seoul, South Korea
Abstract :
An antenna array using in-package bondwire to perform beamforming for 60 GHz applications is presented. 1 mil gold bondwire designed to resonate at 60 GHz was employed as an antenna array to provide smaller area and a cheaper way to manufacture it. The overall size of the bondwire antenna array on a CMOS chip is 1 3 mm2 and its radiation pattern shows fair agreement with simulation results.
Keywords :
CMOS integrated circuits; antenna radiation patterns; array signal processing; millimetre wave antenna arrays; CMOS chip; antenna array; beamforming; frequency 60 GHz; in-package bondwire; radiation pattern;
Journal_Title :
Electronics Letters
DOI :
10.1049/el.2010.1133
