DocumentCode
1255364
Title
A review of thermal enhancement techniques for electronic systems
Author
Fletcher, Leroy S.
Author_Institution
Dept. of Mech. Eng., Texas A&M Univ., College Station, TX, USA
Volume
13
Issue
4
fYear
1990
fDate
12/1/1990 12:00:00 AM
Firstpage
1012
Lastpage
1021
Abstract
Thermal enhancement techniques for maximizing the thermal contact conductance including the use of greases, metallic foils, and screens, composite materials and cements, and surface treatments are reviewed. The relative merits of the various enhancement techniques are summarized and comparisons are made for selected thermal enhancement materials. The results should prove useful in selecting thermal enhancement materials for use in improving the thermal performance of specific electronic systems
Keywords
heat sinks; packaging; surface treatment; thermal conductivity of solids; cements; composite materials; greases; metallic foils; packaging; screens; surface treatments; thermal conductivity; thermal contact conductance; thermal enhancement; Bonding; Building materials; Conducting materials; Control systems; Electronic components; Electronic packaging thermal management; Heat transfer; Surface treatment; Thermal conductivity; Thermal resistance;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.62543
Filename
62543
Link To Document