Title :
Corrosion criteria for electronic packaging. I. A framework for corrosion of integrated circuits
Author_Institution :
Western Digital Corp., Irvine, CA, USA
fDate :
12/1/1990 12:00:00 AM
Abstract :
A framework for aluminum corrosion is presented which identifies aluminum ion diffusion through a dielectric film as the rate-determining step for the process. A mathematical description of corrosion currents based on this framework is also presented. The activation energy for migration of the ion through the film is shown to be dependent on the activation energy for chemical diffusion and the magnitude of the electric field which is established across the dielectric film as a result of an externally applied bias
Keywords :
aluminium; corrosion; integrated circuit technology; metallisation; packaging; Al corrosion; Al3+ ion diffusion; Al3+ ion migration; IC packaging; activation energy; chemical diffusion; corrosion currents; dielectric film; electric field magnitude; electronic packaging; integrated circuit corrosion; rate-determining step; Aluminum; Chemicals; Corrosion; Current measurement; Dielectric films; Electronics packaging; Oxidation; Plastic packaging; Process design; Silicon;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on