Title :
Corrosion criteria for electronic packaging. III. Corrosion by package family
Author_Institution :
Western Digital Corp., Irvine, CA, USA
fDate :
12/1/1990 12:00:00 AM
Abstract :
For pt.II see ibid., p.1098-104, Dec. 1990. The reaction path for catastrophic corrosion requires both condensed moisture and ionic contamination. It is shown here that package types ranging from hermetic ceramic to plastic cavity can be configured reliably as long as materials and assembly methods do not result in the presence of both condensed moisture and ionic contamination on the surface of the encased silicon chip
Keywords :
corrosion; integrated circuit technology; metallisation; packaging; IC; Si; catastrophic corrosion; condensed moisture; electronic packaging; encased silicon chip; hermetic ceramic; integrated circuits; ionic contamination; metallisation; package types; plastic cavity; Aluminum; Contamination; Corrosion; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Moisture; Plastics; Polymers; Silicon;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
