• DocumentCode
    1256188
  • Title

    Low-Dissipation Silicon Tuning Fork Gyroscopes for Rate and Whole Angle Measurements

  • Author

    Trusov, Alexander A. ; Prikhodko, Igor P. ; Zotov, Sergei A. ; Shkel, Andrei M.

  • Author_Institution
    Dept. of Mech. & Aerosp. Eng., Univ. of California, Irvine, CA, USA
  • Volume
    11
  • Issue
    11
  • fYear
    2011
  • Firstpage
    2763
  • Lastpage
    2770
  • Abstract
    We report a new family of ultra high- Q silicon microelectromechanical systems (MEMS) tuning fork gyroscopes demonstrating angular rate and, for the first time, rate integrating (whole angle) operation. The novel mechanical architecture maximizes the Q-factor and minimizes frequency and damping mismatches. We demonstrated the vacuum packaged SOI dual and quadruple mass gyroscopes with Q-factors of 0.64 and 0.86 million at 2 kHz operational frequency, respectively. Due to the stiffness and damping symmetry, the quadruple mass gyroscope was instrumented to measure the angle of rotation directly, eliminating the bandwidth and dynamic range limitations of conventional MEMS vibratory rate gyroscopes. The technology may enable silicon micromachined devices for inertial guidance applications previously limited to precision-machined quartz hemispherical resonator gyroscopes.
  • Keywords
    Q-factor; angular measurement; damping; elemental semiconductors; gyroscopes; inertial navigation; micromechanical resonators; packaging; silicon; silicon-on-insulator; velocity measurement; vibrations; MEMS; Q-factor; Si; damping mismatch; dual mass gyroscopes; frequency mismatch; inertial guidance application; low dissipation silicon tuning fork gyroscopes; micromachined device; quadruple mass gyroscopes; rate integrating operation; rate measurement; ultra high-q silicon microelectromechanical systems; vacuum packaged SOI; whole angle measurement; Frequency measurement; Gyroscopes; Q factor; Sensors; Silicon; Temperature measurement; Vibrations; Energy dissipation; microelectromechanical systems (MEMS) gyroscope; quality factor; rate integrating; vacuum packaging; whole angle;
  • fLanguage
    English
  • Journal_Title
    Sensors Journal, IEEE
  • Publisher
    ieee
  • ISSN
    1530-437X
  • Type

    jour

  • DOI
    10.1109/JSEN.2011.2160338
  • Filename
    5928378