Title :
Method of lines for the calculation of excess capacitance for a cylindrical via hole in multilayer packaging
Author :
Papachristoforos, A.P.
Author_Institution :
Dept. of Electr. Eng., Nat. Tech. Univ. of Athens, Greece
fDate :
8/1/1999 12:00:00 AM
Abstract :
The method of lines (MOL) is extended for the analysis of different geometries that include both rectangular and cylindrical conductors. The method of analysis is valid for multilevel dielectric structures. The cylindrical conductors can have circular pads and rectangular microstrips that are attached to the pads or the main body of the cylindrical via (buried microstrips). The mixed structures can include many ground planes with circular openings through which the via passes. The results are compared with previous results
Keywords :
capacitance; conducting bodies; dielectric bodies; method of lines; microstrip lines; packaging; buried microstrips; circular openings; circular pads; cylindrical conductors; cylindrical via hole; excess capacitance; ground planes; method of lines; mixed structures; multilayer packaging; multilevel dielectric structures; rectangular conductors; rectangular microstrips;
Journal_Title :
Microwaves, Antennas and Propagation, IEE Proceedings
DOI :
10.1049/ip-map:19990449
