Monte Carlo thermal optimization of populated printed circuit board

Author

Eliasi, Rami ; Elperin, Tov ; Bar-Cohen, Avram

Author_Institution

Dept. of Mech. Eng., Ben-Gurion Univ. of the Negev, Beer Sheva, Israel

Volume

13

Issue

4

fYear

1990

fDate

12/1/1990 12:00:00 AM

Firstpage

953

Lastpage

960

Abstract

The methodology and results of a Monte Carlo optimization of component placement on a printed circuit board are presented. The overall reliability of the component mix on the printed circuit board is the criterion of optimality. Arrhenius relations are used to quantify the effect of temperature on the component failure rate. The finite element code called ANSYS is used to determine the temperature distribution in two conductively cooled printed circuit boards. The various strategies of the Monte Carlo annealing and cluster optimization methods and the effect of the relevant parameters on board reliability are discussed

Keywords

Monte Carlo methods; annealing; circuit analysis computing; circuit layout CAD; failure analysis; finite element analysis; optimisation; printed circuits; reliability; ANSYS; Arrhenius relations; Monte Carlo thermal optimization; annealing; cluster optimization; component failure rate; component placement; conductively cooled printed circuit boards; finite element code; populated printed circuit board; reliability; temperature distribution; Electronic packaging thermal management; Electronics packaging; Mechanical engineering; Microelectronics; Monte Carlo methods; Optimization methods; Packaging machines; Printed circuits; Stochastic processes; Temperature distribution;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.62568

Filename

62568