Low temperature co-fired glass ceramic high density interconnect substrate with improved thermal management

Author

Rich, Edward L., III ; Martin, Angela J. ; Lengel, Theresa M. ; Stewart, John J. ; Gallo, Stephen A.

Author_Institution

Westinghouse Electr. Corp., Baltimore, MD, USA

Volume

13

Issue

4

fYear

1990

fDate

12/1/1990 12:00:00 AM

Firstpage

639

Lastpage

646

Abstract

A hybrid integrated regulator/modulator with a digital and analog signal bus system for power conditioning of a transmit/receive module having a density figure of merit of 69 W/in³ and 845 W/lb is described. High-density multichip power conditioning modules were designed using a low-temperature cofired ceramic as the base substrate. The design was fabricated, tested, and delivered. Design considerations, guidelines, and fabrication concerns are discussed. Aspects discussed include high-density computer aided design and packaging concepts, the regulator/modulator approach to power conditioning, design guidelines and substrate characteristics of the glass-ceramic material system, thermal management solutions for high-powered chips, and reliability and performance data on the finished substrate and module. Emphasis is on the improved processing of blind thermal slots and cofired top metallization. An appreciable improvement of thermal conductivity with thermal vias was achieved

Keywords

ceramics; electronic engineering computing; glass; hybrid integrated circuits; integrated circuit technology; microwave integrated circuits; modules; packaging; power integrated circuits; substrates; density figure of merit; digital and analog signal bus system; high density interconnect substrate; high-density computer aided design; hybrid integrated regulator/modulator; low temperature cofired glass ceramics; metallization; multichip power conditioning modules; packaging concepts; power conditioning; reliability; thermal conductivity; thermal management; thermal vias; transmit/receive module; Ceramics; Glass; Guidelines; Power conditioning; Power system interconnection; Power system reliability; Regulators; Temperature; Thermal conductivity; Thermal management;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.62573

Filename

62573