Title :
Preparation, structure, and fracture modes of Pb-Sn and Pb-In terminated flip-chips attached to gold capped microsockets
Author :
Puttlitz, Karl J.
Author_Institution :
IBM Corp., Hopewell Junction, NY, USA
fDate :
12/1/1990 12:00:00 AM
Abstract :
The effects of using nickel deposited from an electroless phosphorus-based bath as the base metal to achieve solder wetting for chip interconnection is discussed. Specifically discussed are the degradation effects on solder wetting caused by precipitate formation during process thermal exposure, and the use of a gold cap to prevent the problem. The overall metallurgical characteristics of both lead-tin and lead-indium controlled-collapse chip connection joints, as well as their relation to performance (e.g. fracture mode and fatigue life) are discussed. Preliminary processing and microsocket preparation are discussed
Keywords :
fatigue; flip-chip devices; fracture; indium alloys; integrated circuit technology; lead alloys; microassembling; packaging; soldering; tin alloys; Au capped microsockets; Ni deposition; PbIn; PbSn terminated flip chips; chip interconnection; controlled-collapse chip connection joints; degradation effects; electroless P bath; electroless plating; fatigue life; fracture modes; metallurgical characteristics; precipitate formation; process thermal exposure; solder bump flip chip connections; solder wetting; Ceramics; Conducting materials; Fatigue; Gold; Lead; Metallization; Nickel; Rendering (computer graphics); Substrates; Thick films;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
