Title :
A comparison of copper and gold wire bonding on integrated circuit devices
Author :
Khoury, Salim L. ; Burkhard, David J. ; Galloway, David P. ; Scharr, Thomas A.
Author_Institution :
Motorola Semicond. Products Inc., Mesa, AZ, USA
fDate :
12/1/1990 12:00:00 AM
Abstract :
A study carried out to investigate the process and material variables in developing a copper wire bond assembly process and to determine the potential performance and reliability of the finished product. A summary of Cu and Au comparison results for die bond, material selection, ball shear, and wire pull evaluations is given. The electrical and thermal performances are described. The intermetallics and reliability results are discussed
Keywords :
copper; gold; integrated circuit technology; lead bonding; reliability; Au wire bonding; Cu wire bond assembly process; ball shear; die bond; electrical performance; integrated circuit devices; intermetallics; material selection; reliability; thermal performances; wire pull evaluations; Artificial intelligence; Assembly; Bonding; Copper; Gold; Intermetallic; Metallization; Silver; Temperature; Wire;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
