Title :
A new technique for testing TAB bonded LSIs in the gigahertz frequency range
Author :
Kon, Taichi ; Sasaki, Shinichi ; Konno, Riyo
Author_Institution :
NTT Appl. Electron. Lab., Tokyo, Japan
fDate :
12/1/1990 12:00:00 AM
Abstract :
A testing technique for tap automated bonding (TAB) bonded LSIs operating in the gigahertz frequency is described. With this technique, a TAB tape is sandwiched between test tools so as to assume a stripline configuration during testing. This technique enables the testing frequency range to be dramatically extended by reducing reflection noise caused by impedance mismatch between the test leads and the test sets. The maximum testing bit rate achieved reached 5 Gb/s, which is 2.5 times greater than with the conventional technique
Keywords :
integrated circuit testing; large scale integration; tape automated bonding; 5 Gbit/s; TAB bonded LSI testing technique; TAB tape; gigahertz frequency; impedance mismatch; reflection noise; stripline configuration; tap automated bonding; testing bit rate; testing frequency range; Acoustic reflection; Bonding; Crosstalk; Frequency; Impedance; Insulation; Insulator testing; Large scale integration; Metal-insulator structures; Noise reduction;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
