DocumentCode
1257787
Title
A new technique for testing TAB bonded LSIs in the gigahertz frequency range
Author
Kon, Taichi ; Sasaki, Shinichi ; Konno, Riyo
Author_Institution
NTT Appl. Electron. Lab., Tokyo, Japan
Volume
13
Issue
4
fYear
1990
fDate
12/1/1990 12:00:00 AM
Firstpage
682
Lastpage
684
Abstract
A testing technique for tap automated bonding (TAB) bonded LSIs operating in the gigahertz frequency is described. With this technique, a TAB tape is sandwiched between test tools so as to assume a stripline configuration during testing. This technique enables the testing frequency range to be dramatically extended by reducing reflection noise caused by impedance mismatch between the test leads and the test sets. The maximum testing bit rate achieved reached 5 Gb/s, which is 2.5 times greater than with the conventional technique
Keywords
integrated circuit testing; large scale integration; tape automated bonding; 5 Gbit/s; TAB bonded LSI testing technique; TAB tape; gigahertz frequency; impedance mismatch; reflection noise; stripline configuration; tap automated bonding; testing bit rate; testing frequency range; Acoustic reflection; Bonding; Crosstalk; Frequency; Impedance; Insulation; Insulator testing; Large scale integration; Metal-insulator structures; Noise reduction;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.62579
Filename
62579
Link To Document