Title :
Area distributed soldering of flexible and rigid printed circuit boards
Author :
Clark, W.A. ; Pelosi, W.
Author_Institution :
AT&T Bell Lab., Whippany, NJ, USA
fDate :
12/1/1990 12:00:00 AM
Abstract :
A design process which was developed to facilitate area-distributed soldering of a flexible printed circuit to a circuit pack in an inspectable and repairable manner is described. In the design, solder joints are formed between surface-mount pads on a rigid printed-circuit board and plated through holes on a flexible printed circuit. The joints are formed by heating both the flexible printed circuit and the printed circuit board to reflow temperatures and then allowing solder that has been deposited on the surface mount pads to rise through the plated through holes. Because solder rises up through the plated through holes to the exterior surface of the flexible printed circuit, spherical solder caps are clearly visible and inspectable. Solder joints are also easily repaired since the flexible printed circuit can be reheated to reflow one or all of the solder joints
Keywords :
assembling; printed circuit design; printed circuit manufacture; soldering; surface mount technology; area-distributed soldering; assembly process; circuit pack; flexible printed circuit; inspection; plated through holes; reflow temperatures; repairing; rigid printed circuit boards; solder joints; spherical solder caps; surface-mount pads; Assembly; Backplanes; Connectors; Crosstalk; Flexible printed circuits; Integrated circuit interconnections; Lead; Reflection; Sockets; Soldering;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
