Area distributed soldering of flexible and rigid printed circuit boards

Author

Clark, W.A. ; Pelosi, W.

Author_Institution

AT&T Bell Lab., Whippany, NJ, USA

Volume

13

Issue

4

fYear

1990

fDate

12/1/1990 12:00:00 AM

Firstpage

698

Lastpage

703

Abstract

A design process which was developed to facilitate area-distributed soldering of a flexible printed circuit to a circuit pack in an inspectable and repairable manner is described. In the design, solder joints are formed between surface-mount pads on a rigid printed-circuit board and plated through holes on a flexible printed circuit. The joints are formed by heating both the flexible printed circuit and the printed circuit board to reflow temperatures and then allowing solder that has been deposited on the surface mount pads to rise through the plated through holes. Because solder rises up through the plated through holes to the exterior surface of the flexible printed circuit, spherical solder caps are clearly visible and inspectable. Solder joints are also easily repaired since the flexible printed circuit can be reheated to reflow one or all of the solder joints

Keywords

assembling; printed circuit design; printed circuit manufacture; soldering; surface mount technology; area-distributed soldering; assembly process; circuit pack; flexible printed circuit; inspection; plated through holes; reflow temperatures; repairing; rigid printed circuit boards; solder joints; spherical solder caps; surface-mount pads; Assembly; Backplanes; Connectors; Crosstalk; Flexible printed circuits; Integrated circuit interconnections; Lead; Reflection; Sockets; Soldering;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.62582

Filename

62582