• DocumentCode
    1257866
  • Title

    An LU Decomposition Based Direct Integral Equation Solver of Linear Complexity and Higher-Order Accuracy for Large-Scale Interconnect Extraction

  • Author

    Chai, Wenwen ; Jiao, Dan

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
  • Volume
    33
  • Issue
    4
  • fYear
    2010
  • Firstpage
    794
  • Lastpage
    803
  • Abstract
    A fast LU factorization of linear complexity is developed to directly solve a dense system of linear equations for the capacitance extraction of any arbitrary shaped 3-D structure embedded in inhomogeneous materials. In addition, a higher-order scheme is developed to achieve any higher-order accuracy for the proposed fast solver without sacrificing its linear computational complexity. The proposed solver successfully factorizes dense matrices that involve more than one million unknowns in fast CPU run time and modest memory consumption. Comparisons with state-of-the-art integral-equation-based capacitance solvers have demonstrated its clear advantages. In addition to capacitance extraction, the proposed LU solver has been successfully applied to large-scale full-wave extraction.
  • Keywords
    capacitance; circuit complexity; integral equations; matrix decomposition; 3D structure; LU decomposition based direct integral equation solver; LU factorization; LU solver; capacitance extraction; dense matrices; dense system; inhomogeneous material; large-scale full wave extraction; large-scale interconnect extraction; linear computational complexity; linear equation; state-of-the-art integral-equation-based capacitance solver; Capacitance; Computational complexity; Conductors; Electronics industry; Integral equations; Iterative methods; Large-scale systems; Sparse matrices; Direct solver; LU factorization; fast solver; integral-equation-based methods; interconnect extraction;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2010.2053537
  • Filename
    5524090