New screen printable polyimide for IC devices

Author

Nishizawa, Hiroshi ; Suzuki, Kenji ; Kikuchi, Tohru ; Satou, Hidetaka

Author_Institution

Hitachi Chem. Co. Ltd., Ibaraki, Japan

Volume

13

Issue

4

fYear

1990

fDate

12/1/1990 12:00:00 AM

Firstpage

775

Lastpage

779

Abstract

To develop a new screen-printable polyimide paste, structures, properties, and the ratios of three major paste components (filler, binder, and solvent) were studied and a new film-forming strategy was established. This strategy comprises a new type of polyimide particle filler which can be dissolved in the binder and the solvent under the curing condition. Using this strategy, the new screen-printable polyimide paste was developed. This paste produces a uniform film with better mechanical properties than conventional polyimide paste which is comprised of an insoluble polyimide particle filler. The effect of the solubility parameter of the solvent on mask swelling and moisture resistance was also examined. It was found that a lactone with a solubility parameter value of 18-20 (MJ/M³)^1/2 is suitable as a paste solvent and the lifetime of the stencil is extended over that of the conventional paste

Keywords

filled polymers; heat treatment; integrated circuit technology; polymer films; scanning electron microscope examination of materials; solubility; swelling; tensile strength; SEM; binder; curing condition; film-forming strategy; lactone; mask swelling; mechanical properties; moisture resistance; paste solvent; pin hole density; polyimide particle filler; screen-printable polyimide paste; solubility parameter; stencil lifetime; tensile strength; Chemicals; Coatings; Curing; Etching; Mechanical factors; Polyimides; Printing; Silicon compounds; Solvents; Thermal stresses;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.62592

Filename

62592