Title :
Self-aligned flip-chip assembly of protonic devices with electrical and optical connections
Author :
Wale, Michael J. ; Edge, Colin
Author_Institution :
Plessey Res. Caswell Ltd., Towcester, UK
fDate :
12/1/1990 12:00:00 AM
Abstract :
A technique is discussed which offers major advantages in performance, ruggedness, and cost in the interfacing of integrated optical circuits. The technique is based on a self-aligned flip-chip solder bump bonding process and achieves ~1-μm accuracy in optical fiber placement without requiring micromanipulation of piece parts during final assembly. A high density of electrical interconnections is achieved simultaneously with the optical fiber connections. Material considerations, precision, and reproducibility are discussed
Keywords :
flip-chip devices; integrated optoelectronics; optical couplers; soldering; cost; flip-chip assembly; high density of electrical interconnections; interfacing of integrated optical circuits; materials consideration; multifibre assembly; optical fiber connections; optical fiber placement; performance; precision; protonic devices; reproducibility; ruggedness; self-aligned flip-chip; self-aligning solder bump bonding; solder bump bonding process; Assembly; Circuits; Etching; Geometrical optics; Integrated optics; Optical arrays; Optical devices; Optical fibers; Optical losses; Silicon;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on