• DocumentCode
    1257949
  • Title

    A novel laser-processed self-aligned gate-overlapped LDD poly-Si TFT

  • Author

    Lin, Ching-Wei ; Tseng, Chang-Ho ; Chang, Ting-Kuo ; Lin, Chiung-Wei ; Wang, Wen-Tung ; Cheng, Huang-Chung

  • Author_Institution
    Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • Volume
    23
  • Issue
    3
  • fYear
    2002
  • fDate
    3/1/2002 12:00:00 AM
  • Firstpage
    133
  • Lastpage
    135
  • Abstract
    A novel process for fabricating self-aligned gate-overlapped LDD (SAGOLDD) poly-Si thin film transistors (TFTs) was demonstrated. Laser irradiation for dopant activation was performed from the backside of the quartz wafer. The graded LDD structure was naturally formed under the gate edges due to the lateral diffusion of the dopants during the laser activation. In comparison with the conventional laser-processed self-aligned poly-Si TFTs, the SAGOLDD poly-Si TFTs exhibited lower leakage current, suppressed kink effect, and higher reliability. Moreover, the proposed process was simple and very suitable for low-temperature processing.
  • Keywords
    diffusion; elemental semiconductors; field effect integrated circuits; integrated circuit technology; laser materials processing; leakage currents; semiconductor device reliability; silicon; thin film transistors; SAGOLDD TFTs; Si; dopant activation; excimer laser irradiation; fabrication process; gate-overlapped LDD TFT; graded LDD structure; kink effect suppression; laser irradiation; laser-processed poly-Si TFT; lateral diffusion; leakage current reduction; low-temperature process; poly-Si thin film transistors; polysilicon TFTs; quartz wafer backside; reliability; self-aligned poly-Si TFT; Active matrix liquid crystal displays; Active matrix organic light emitting diodes; Integrated circuit reliability; Leakage current; Optical device fabrication; Optical pulses; Pulsed laser deposition; Sputtering; Substrates; Thin film transistors;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.988815
  • Filename
    988815