• DocumentCode
    1258224
  • Title

    Rapid thermal hydrogen passivation of polysilicon MOSFETs

  • Author

    Batra, S. ; Park, K. ; Banerjee, Sanjay ; Kwong, D. ; Tasch, Al ; Rodder, Mark ; Sundaresan, R.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
  • Volume
    11
  • Issue
    5
  • fYear
    1990
  • fDate
    5/1/1990 12:00:00 AM
  • Firstpage
    194
  • Lastpage
    196
  • Abstract
    The effectiveness of rapid thermal annealing as a passivation technique using Si/sub 3/N/sub 4/ as a solid source of H is discussed. Polysilicon MOSFETs with an on/off ratio of 10/sup 7/ can be obtained through rapid thermal hydrogen passivation, compared to an on/off ratio of 10/sup 6/ after furnace passivation. The improvement of subthreshold slope, threshold voltage, and channel transconductance compared to unpassivated MOSFETs is greater for rapid thermal annealing (RTA) than for furnace passivation.<>
  • Keywords
    annealing; insulated gate field effect transistors; passivation; channel transconductance; on/off ratio; passivation technique; polysilicon MOSFETs; rapid thermal annealing; subthreshold slope; threshold voltage; Furnaces; Grain boundaries; Hydrogen; Implants; MOSFETs; Passivation; Random access memory; Rapid thermal annealing; Silicon; Solids;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.55247
  • Filename
    55247