DocumentCode
1258749
Title
Dielectric properties of epoxy based nanocomposites for high voltage insulation
Author
Iyer, G. ; Gorur, R.S. ; Richert, R. ; Krivda, A. ; Schmidt, L.E.
Author_Institution
Sch. of Electr., Energy & Comput. Eng., Arizona State Univ. Tempe, Tempe, AZ, USA
Volume
18
Issue
3
fYear
2011
fDate
6/1/2011 12:00:00 AM
Firstpage
659
Lastpage
666
Abstract
Epoxy polymer with micro, nano and micro + nano silica fillers have been evaluated for their electrical performance in high voltage insulation applications. The dielectric strength of these samples was measured in accordance with the ASTM D-149 standard. Dielectric spectroscopy was used to understand the role of space charge and interfaces in these materials. The results of dielectric spectroscopy suggest that significant improvement in the electrical performance can be expected by using samples containing nanofillers and micro + nanofillers when compared to materials containing only microfillers. However, the dielectric strength measurement showed no statistically significant improvement for the nanofilled samples. Techniques other than dielectric breakdown may be required to adequately characterize differences in the electrical performance of the dielectrics. For example, a partial discharge test using a highly non-uniform field may be more useful as it would correspond to simulate actual service conditions.
Keywords
dielectric properties; electric breakdown; epoxy insulation; nanocomposites; polymer insulators; ASTM D-149 standard; dielectric breakdown; dielectric properties; dielectric spectroscopy; epoxy polymer; high voltage insulation; nanocomposites; nanosilica fillers; Dielectrics; Nanocomposites; Permittivity; Permittivity measurement; Silicon compounds; Temperature measurement; Epoxy nanocomposites; breakdown; dielectric strength; loss tangent; microcomposites; nanodielectrics; nanofillers; permittivity;
fLanguage
English
Journal_Title
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher
ieee
ISSN
1070-9878
Type
jour
DOI
10.1109/TDEI.2011.5931050
Filename
5931050
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