Title :
Influence of FeCo-interlayer thickness on remanence and coercivity in SmCo/FeCo/SmCo triple-layer films
Author :
Liu, X.H. ; Yan, G. ; Cui, L.Y. ; Zhou, S.X. ; Zheng, W. ; Wang, A.L. ; Chen, J.C.
Author_Institution :
Nat. Atmos. & Nanocrystalline Alloy Eng. Res. Center, Central Iron & Steel Res. Inst., Beijing, China
fDate :
9/1/1999 12:00:00 AM
Abstract :
The dependence of reduced remanence (Mr/Ms) and coercivity of Sm 22Co78/Fe65Co35/Sm22 Co78 triple-layer films on Fe65Co35 soft-magnetic interlayer thickness, d, was systematically investigated. All the hysteresis loops of the triple-layer films exhibit a single-phase behavior, reflecting a strong exchange coupling between soft- and hard-magnetic phases. Mr/Ms shows a monotonic increase with increasing the Fe65Co35 thickness, d, and the coercivity exists a peak with increasing d. From the plot of the interaction-based deviation parameter ΔM (H) of two principle remanence curves (isothermal remanence magnetization and dc-demagnetization remanence) versus applied field, H, a negative interaction profile was observed, indicating a negligible inter-granular exchange coupling within hard-magnetic grains
Keywords :
cobalt alloys; coercive force; exchange interactions (electron); ferromagnetic materials; iron alloys; magnetic hysteresis; magnetic multilayers; permanent magnets; remanence; samarium alloys; soft magnetic materials; Fe65Co35 soft-magnetic interlayer thickness; FeCo-interlayer thickness; Sm22Co78-Fe65Co35-Sm 22Co78; Sm22Co78/Fe65Co35/Sm 22Co78 triple-layer films; SmCo/FeCo/SmCo triple-layer films; coercivity; dc-demagnetization remanence; hard-magnetic grains; hard-magnetic phases; hysteresis loops; inter-granular exchange coupling; isothermal remanence magnetization; negative interaction profile; reduced remanence; remanence; remanence curves; single-phase behavior; strong exchange coupling; Chromium; Coercive force; Control systems; Couplings; Hysteresis; Magnetization; Optical films; Remanence; Sputtering; Thickness control;
Journal_Title :
Magnetics, IEEE Transactions on
