Title : 
Advanced dielectric properties of BaTiO3/polyvinylidene-fluoride nanocomposites with sandwich multi-layer structure
         
        
            Author : 
Zha, Jun-Wei ; Dang, Zhi-Min ; Yang, Tai ; Zhou, Tao ; Song, Hong-Tao ; Li, Sheng-Tao
         
        
            Author_Institution : 
Dept. of Polymer Sci. & Eng., Univ. of Sci. & Technol. Beijing, Beijing, China
         
        
        
        
        
            fDate : 
8/1/2012 12:00:00 AM
         
        
        
        
            Abstract : 
To endow excellent dielectric properties for embedded capacitors application, high-permittivity BaTiO3/polyvinylidene fluoride (BT/PVDF) nanocomposites with sandwich multi-layer structure were fabricated via a spin-coated and hot-molding technique. Dependences of dielectric properties of the BT/PVDF multi-layer nanocomposites on frequency and temperature were studied. Results show that concentration and dispersion of BT particles in multi-layer structure nanocomposites had an obvious influence on the final dielectric permittivity. Influence of the compatibility between adjacent layers on dielectric permittivity was also discussed. We use the effective-medium theory and capacitance series model to predict the theoretical values of the dielectric permittivity of the nanocomposites.
         
        
            Keywords : 
barium compounds; capacitors; fluorine compounds; multilayers; nanocomposites; permittivity; polymers; sandwich structures; spin coating; titanium compounds; BT-PVDF nanocomposite; BaTiO3; capacitance series model; dielectric permittivity; dielectric properties; effective-medium theory; embedded capacitor; hot-molding technique; multilayer nanocomposite; polyvinylidene-fluoride nanocomposite; sandwich multilayer structure; spin-coated technique; Capacitors; Ceramics; Loading; Nanocomposites; Permittivity; Polymers; BaTiO3; Dielectric permittivity; PVDF; multi-layer structure; nanocomposite;
         
        
        
            Journal_Title : 
Dielectrics and Electrical Insulation, IEEE Transactions on
         
        
        
        
        
            DOI : 
10.1109/TDEI.2012.6260006