• DocumentCode
    1259450
  • Title

    Optimized redundancy selection based on failure-related yield model for 64-Mb DRAM and beyond

  • Author

    Kikuda, Shigeru ; Miyamoto, Hiroshi ; Mori, Shigeru ; Niiro, Mitsutaka ; Yamada, Michihiro

  • Author_Institution
    Mitsubishi Electr. Corp., Hyogo, Japan
  • Volume
    26
  • Issue
    11
  • fYear
    1991
  • fDate
    11/1/1991 12:00:00 AM
  • Firstpage
    1550
  • Lastpage
    1555
  • Abstract
    An optimized redundancy scheme for 64-Mb dynamic RAM (DRAM) and beyond that is based on a failure-related yield model is described. This model accounts for three-dimensional memory cell structures and individual design rules used in individual sections of the chip. Failure-mode parameters for the model are determined by performing a trial fuse-blowing test on 4-Mb DRAMs. The test employs a memory tester without requiring complicated visual inspections. The dependence of the yield on block division and the number of spare elements for a 64-Mb DRAM are investigated. In the estimation as a redundancy scheme for the 64-Mb DRAM, more than two spare rows and two spare columns in 1-Mb or less subblocks are shown to be necessary
  • Keywords
    DRAM chips; circuit reliability; failure analysis; integrated circuit testing; redundancy; 3D cell structure; 64 Mbit; DRAM; design rules; dynamic RAM; failure-related yield model; fuse-blowing test; optimized redundancy scheme; three-dimensional memory cell; Circuit faults; Decoding; Fabrication; Integrated circuit modeling; Integrated circuit yield; Performance evaluation; Random access memory; Redundancy; Semiconductor device modeling; Testing;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/4.98971
  • Filename
    98971