• DocumentCode
    1260223
  • Title

    Large spontaneous volume magnetostriction of Mn-Rh alloys

  • Author

    Yamauchi, R. ; Fukamichi, K. ; Yamauchi, H. ; Sasao, K. ; Yamada, K.

  • Author_Institution
    Dept. of Mater. Sci., Tohoku Univ., Sendai, Japan
  • Volume
    35
  • Issue
    5
  • fYear
    1999
  • fDate
    9/1/1999 12:00:00 AM
  • Firstpage
    3799
  • Lastpage
    3801
  • Abstract
    The differential scanning calorimetry (DSC) curves and the temperature dependence of magnetic susceptibility for γ-MnRh ordered alloys show a marked peak associated with the magnetic transition. The Neel temperature of Mn77Rh23 and Mn75Rh25 ordered alloys is determined to be about 830 and 850 K, respectively. The paramagnetic susceptibility increases with increasing temperature, showing an itinerant electron characteristics. The thermal expansion coefficient becomes small below the Neel temperature due to a large spontaneous volume magnetostriction, taking about 5×10-6/K around room temperature. Such alloys with a small thermal expansion coefficient would induce some strain in multilayers because of the difference between the thermal expansion
  • Keywords
    Neel temperature; antiferromagnetic materials; band model of magnetism; differential scanning calorimetry; magnetic susceptibility; magnetostriction; manganese alloys; rhodium alloys; thermal expansion; γ-MnRh ordered alloys; DSC; Mn-Rh alloys; Mn75Rh25; Mn77Rh23; Neel temperature; differential scanning calorimetry; itinerant electron characteristics; large spontaneous volume magnetostriction; magnetic susceptibility; magnetic transition; multilayers; paramagnetic susceptibility; room temperature; strain; temperature dependence; thermal expansion coefficient; Calorimetry; Electrons; Magnetic field induced strain; Magnetic multilayers; Magnetic susceptibility; Magnetostriction; Manganese alloys; Paramagnetic materials; Temperature dependence; Thermal expansion;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.800669
  • Filename
    800669