DocumentCode
1261016
Title
Modeling of Layout Aware Line-Edge Roughness and Poly Optimization for Leakage Minimization
Author
Ban, Yongchan ; Pan, David Z.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Texas, Austin, TX, USA
Volume
1
Issue
2
fYear
2011
fDate
6/1/2011 12:00:00 AM
Firstpage
150
Lastpage
159
Abstract
Line-edge roughness (LER) highly affects the device saturation current and leakage current, which leads to serious device performance degradation. In this paper, we propose the first layout-aware LER model where LER is highly related to the lithographic aerial image fidelity and neighboring geometric proximity. With our new LER model, we perform robust LER aware poly layout optimization to minimize the degradation of device performance, in particular leakage current. The results on 32-nm node standard cells show average 91.26% reduction of leakage current and 4.46% improvement of saturation current at the worst case process corner despite 8.86% area penalty.
Keywords
leakage currents; proximity effect (lithography); semiconductor device models; device saturation current; layout aware line-edge roughness modeling; leakage current; leakage minimization; lithographic aerial image fidelity; node standard cells; polyoptimization; size 32 nm; Layout; Leakage current; Lithography; Logic gates; Optimization; Performance evaluation; Systematics; Design for manufacturing; VLSI design; layout optimization; leakage; line-edge roughness (LER); lithographic variation;
fLanguage
English
Journal_Title
Emerging and Selected Topics in Circuits and Systems, IEEE Journal on
Publisher
ieee
ISSN
2156-3357
Type
jour
DOI
10.1109/JETCAS.2011.2159286
Filename
5934616
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