• DocumentCode
    1261016
  • Title

    Modeling of Layout Aware Line-Edge Roughness and Poly Optimization for Leakage Minimization

  • Author

    Ban, Yongchan ; Pan, David Z.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Texas, Austin, TX, USA
  • Volume
    1
  • Issue
    2
  • fYear
    2011
  • fDate
    6/1/2011 12:00:00 AM
  • Firstpage
    150
  • Lastpage
    159
  • Abstract
    Line-edge roughness (LER) highly affects the device saturation current and leakage current, which leads to serious device performance degradation. In this paper, we propose the first layout-aware LER model where LER is highly related to the lithographic aerial image fidelity and neighboring geometric proximity. With our new LER model, we perform robust LER aware poly layout optimization to minimize the degradation of device performance, in particular leakage current. The results on 32-nm node standard cells show average 91.26% reduction of leakage current and 4.46% improvement of saturation current at the worst case process corner despite 8.86% area penalty.
  • Keywords
    leakage currents; proximity effect (lithography); semiconductor device models; device saturation current; layout aware line-edge roughness modeling; leakage current; leakage minimization; lithographic aerial image fidelity; node standard cells; polyoptimization; size 32 nm; Layout; Leakage current; Lithography; Logic gates; Optimization; Performance evaluation; Systematics; Design for manufacturing; VLSI design; layout optimization; leakage; line-edge roughness (LER); lithographic variation;
  • fLanguage
    English
  • Journal_Title
    Emerging and Selected Topics in Circuits and Systems, IEEE Journal on
  • Publisher
    ieee
  • ISSN
    2156-3357
  • Type

    jour

  • DOI
    10.1109/JETCAS.2011.2159286
  • Filename
    5934616