Thermal analysis of a suspension with an IC-chip

Author

Nomura, Izumi ; Takano, Ken-ichi ; Sat, Isamu

Author_Institution

Adv. Products Dev. Center, TDK Corp., Chiba, Japan

Volume

35

Issue

5

fYear

1999

fDate

9/1/1999 12:00:00 AM

Firstpage

2274

Lastpage

2276

Abstract

Excellent NLTS characteristics at high write frequencies beyond 150 MHz have been realized by a suspension with an IC-chip named “chip on suspension”. The IC-chip, however, causes the temperature rise of both the IC-chip and a merged MR head. The thermal deformation of the suspension is also very critical for flying characteristic of a slider in HDD. Therefore, we have numerically analyzed the thermal distribution and thermal displacement of the suspension with the IC-chip using a 3D-FEM program. The heat of the IC-chip hardly causes the temperature rise of the head. The maximum change of head loading force was simulated to be around 0.04 gram

Keywords

chip scale packaging; digital simulation; disc drives; finite element analysis; hard discs; magnetic heads; temperature distribution; thermal analysis; thermal stability; 150 MHz; 3D-FEM program; HDD; IC-chip; NLTS characteristics; chip on suspension; head loading force; high write frequencies; merged MR head; simulation; slider flying characteristics; suspension; temperature rise; thermal analysis; thermal deformation; thermal displacement; thermal distribution; Analytical models; Circuit simulation; Equivalent circuits; Flexible printed circuits; Frequency; Impedance; Lead; Temperature; Thermal expansion; Thermal stresses;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/20.800797

Filename

800797