Analysis of multiple vias coupling in silicon interposer by using cylindrical mode expansion method

This paper presented a cylindrical mode expansion method for the analysis of the coupling between multiple through silicon vias (TSV) in silicon interposer. The scattering and multi reflection effects between the vertical cylindrical vias are considered by expanding the electromagnetic files surrounding the vias by cylindrical waves. As the method fully captured the physical mechanism of the wave interaction between multiple vias, it can give a high accuracy and fast solution. Based on this method, the effect of the grounded TSVs for the reduction of electromagnetic interference is efficiently analyzed.