• DocumentCode
    1261974
  • Title

    MR sensor oxidation mechanism at high temperature

  • Author

    Xie, Chang ; Davis, Marshall ; Schultz, Allan

  • Author_Institution
    Seagate Recording Heads, Bloomington, MN, USA
  • Volume
    35
  • Issue
    5
  • fYear
    1999
  • fDate
    9/1/1999 12:00:00 AM
  • Firstpage
    2619
  • Lastpage
    2621
  • Abstract
    A lifetime stress experiment was done on MR heads, followed by TEM analysis to decide whether higher temperatures induced structural degradation in the MRE stack. After 160 hrs, of testing at various bias currents, it was found that heads with sensor operating temperatures below 280°C had little or no resistance increase, heads operated between 280 and 340°C had varying degrees of resistance increase, and all heads operated above 340°C burned out. The immediate cause of the resistance increase is shown to be oxidation of the MR film. A combination of TEM and electrical data, along with thermodynamic analysis of the TaN cap and the alumina 2nd gap, indicates that the likely mechanism is attack of the TaN cap by water vapor released from the alumina, followed by oxidation of the MR film
  • Keywords
    high-temperature effects; magnetic heads; magnetoresistive devices; oxidation; transmission electron microscopy; 280 to 340 C; Al2O3; MR sensor; TEM; TaN; TaN cap; alumina gap; electrical resistance; high temperature oxidation; lifetime stress; magnetoresistive head; thermodynamic analysis; Degradation; Electric resistance; Electrons; Failure analysis; Life testing; Magnetic heads; Oxidation; Temperature sensors; Thermal stresses; Thermodynamics;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.800914
  • Filename
    800914