Title :
High-performance inter-PCB connectors: analysis of EMI characteristics
Author :
Ye, Xiaoning ; Drewniak, James L. ; Nadolny, Jim ; Hockanson, David M.
Author_Institution :
Dept. of Electr. & Comput. Eng., Missouri Univ., Rolla, MO, USA
fDate :
2/1/2002 12:00:00 AM
Abstract :
Electromagnetic interference (EMI) coupling associated with inter-board connection is investigated. Two experimental techniques, based on |S21| measurements, including both common-mode current and near-field measurements, are reported. Both methods, as well as finite difference time domain (FDTD) modeling, were used as experimental and numerical tools for inter-printed-circuit-board (inter-PCB) connector evaluation. The EMI performance of a lab-constructed stacked-card connector, and a commercially available module-on-backplane connector were studied. EMI characteristics of the connectors are demonstrated by investigating a few aspects of the design: type of shield/ground blade for signal return, number and length of ground pins, signal pin designation, etc. Good agreement is achieved between the measurements and the FDTD modeled results
Keywords :
electric connectors; electric current measurement; electric field measurement; electromagnetic coupling; electromagnetic interference; electromagnetic shielding; finite difference time-domain analysis; magnetic field measurement; printed circuit testing; EMI coupling; EMI performance; FDTD modeling; common-mode current measurement; electromagnetic interference coupling; finite difference time domain modeling; ground pin length; high-performance inter-PCB connectors; inter-board connection; module-on-backplane connector; near-field measurement; shield/ground blade; signal pin designation; signal return; stacked-card connector; Blades; Connectors; Current measurement; Electromagnetic coupling; Electromagnetic interference; Electromagnetic measurements; Finite difference methods; Pins; Signal design; Time domain analysis;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
