Title :
Effective elastic modulus of underfill material for flip-chip applications
Author :
Qu, Jianmin ; Wong, C.P.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
3/1/2002 12:00:00 AM
Abstract :
In this paper, a micromechanics model based on the Mori-Tanaka method was developed to estimate the elastic modulus of underfill materials. An explicit expression of the underfill modulus was derived as a function of filler content and the properties of the matrix and the fillers. Predictions of the modulus from this theory were compared with experimentally measured values. Excellent agreement was observed
Keywords :
elastic moduli; filled polymers; flip-chip devices; micromechanics; Mori-Tanaka method; elastic modulus; filled polymer; flip-chip package; micromechanical model; underfill material; Capacitive sensors; Ceramics; Composite materials; Encapsulation; Fatigue; Packaging; Semiconductor device measurement; Silicon; Soldering; Thermal expansion;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.991175
