Reliability of plastic ball grid array package

Author

Sawada, Yuko ; Yamaguchi, Akihiko ; Oka, Seiji ; Fujioka, Hirofumi

Author_Institution

Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan

Volume

25

Issue

1

fYear

2002

fDate

3/1/2002 12:00:00 AM

Firstpage

73

Lastpage

77

Abstract

The reliability of plastic ball grid array (PBGA) package is studied for different materials. The reliability of the PBGA packages using conventional Bismaleimide-Triazine type PWB and our original product PWB that is made of high Tg epoxy resin is evaluated. The PBGA package using our original PWB has a feature of lower warpage for the package, and has similar performance regarding the thermal cycling stability and the endurance during reflow soldering as compared with the PBGA using the conventional PWB. The endurance during reflow soldering for each PBGA is JEDEC STD Method A112 level 3. In order to improve the endurance during reflow soldering, not only PWB materials but also other factors are investigated. As a result, the molding compound with the property of low moisture absorption and the die attach material with the properties of high adhesion strength and fracture strength are effective to improve the endurance property during reflow soldering. The package crack mechanism during reflow soldering is briefly described as follows

Keywords

adhesion; ball grid arrays; fracture; integrated circuit reliability; microassembling; moisture; moulding; plastic packaging; reflow soldering; thermal stability; Bismaleimide-Triazine type PWB; JEDEC STD Method A112 level 3; adhesion strength; die attach material; endurance; epoxy resin; fracture strength; moisture absorption; molding compound; package crack mechanism; plastic ball grid array package; reflow soldering; reliability; thermal cycling stability; warpage; Absorption; Adhesives; Electronics packaging; Epoxy resins; Materials reliability; Microassembly; Moisture; Plastic packaging; Reflow soldering; Thermal stability;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.991178

Filename

991178