Title :
A low-impedance open-bitline array for multigigabit DRAM
Author :
Sekiguchi, Tomonori ; Itoh, Kiyoo ; Takahashi, Tsugio ; Sugaya, Masahiro ; Fujisawa, Hiroki ; Nakamura, Masayuki ; Kajigaya, Kazuhiko ; Kimura, Katsutaka
Author_Institution :
Central Res. Lab., Hitachi Ltd., Tokyo, Japan
fDate :
4/1/2002 12:00:00 AM
Abstract :
The noise-generating mechanisms inherent in the open-bitline DRAM array using the 6F2 (F: feature size) memory cells and techniques for reducing the noise are described. The sources of differential noise coupled to the paired bitlines laid out in two arrays are the p-well, cell plate, and the group of nonselected wordlines. It was found, by simulation and by experiment with a 0.13-μm 256-Mb test chip, that the level of noise is dramatically reduced by using a low-impedance array with careful layout featuring low-resistivity materials, tight bridging between pairs of adjacent arrays, and a small array, achieving a comparable level of noise to that seen in the twisted and folded-bitline array. On basis of these results, it turns out that the open-bitline array has a strong chance of revival in the multigigabit generation, as long as these noise reduction techniques are applied
Keywords :
DRAM chips; cellular arrays; circuit simulation; integrated circuit layout; integrated circuit noise; interference suppression; memory architecture; 0.13 micron; 256 Mbit; 6F2 memory cells; adjacent arrays; cell plate; differential noise sources; impedance open-bitline array; layout; low-impedance array; low-resistivity materials; multigigabit DRAM; noise reduction techniques; noise-generating mechanisms; nonselected wordlines; p-well; paired bitlines; simulation; stacked-capacitor cell; tight bridging; Associate members; Capacitance; Costs; Materials testing; Noise generators; Noise level; Noise reduction; Random access memory; Semiconductor device noise; Tin;
Journal_Title :
Solid-State Circuits, IEEE Journal of