Novel aluminium-silicon alloys for electronics packaging

Author

Sangha, S.P.S. ; Jacobson, D.M. ; Ogilvy, A.J.W. ; Azema, M. ; Junai, A. Arun ; Botter, E.

Author_Institution

Hirst Div., GEC-Marconi Mater. Technol. Ltd., Borhamwood, UK

Volume

6

Issue

5

fYear

1997

fDate

10/1/1997 12:00:00 AM

Firstpage

195

Lastpage

201

Abstract

A novel series of aluminium-silicon alloys has been developed using the Osprey method. These high silicon (50-70 wt%) content alloys have fine, isotropic microstructure. Unlike the conventional silicon-carbide-containing metal matrix composites (MMCs), the new alloys are readily machinable using conventional carbide tools and are easily platable with nickel, copper, silver and gold. The electroplated layers remain adherent and blister free up to 450°C. The characterisation of the alloys in terms of their resistivity, thermal conductivity and thermal expansivity is described. The methodology for fabricating electronics packages is also described

Keywords

aluminium alloys; crystal microstructure; electrical conductivity; electroplating; packaging; silicon alloys; thermal conductivity; thermal expansion; Al-Si; Al-Si alloy; Osprey method; alloy manufacture; alloys characterisation; aluminium-silicon alloys; blister free electroplated layer; carbide tools; copper plating; electronics packaging; electroplated layers; fine isotropic microstructure; gold plating; machinable alloys; nickel plating; resistivity; silver plating; thermal conductivity; thermal expansivity;

fLanguage

English

Journal_Title

Engineering Science and Education Journal

Publisher

iet

ISSN

0963-7346

Type

jour

DOI

10.1049/esej:19970502

Filename

626678