DocumentCode :
1264642
Title :
CMOS RF Transmitter Using Pulsewidth Modulation for Wireless Smart Sensors
Author :
Lee, Wanghoon ; Takao, Hidekuni ; Sawada, Kazuaki ; Ishida, Makoto
Author_Institution :
Japan Sci. & Technol. Agency, Tokyo, Japan
Volume :
2
Issue :
9
fYear :
2012
Firstpage :
1501
Lastpage :
1509
Abstract :
This paper presents the radio frequency (RF) transmitter using pulsewidth modulation (PWM) method. The proposed transmitter can perform with lower power consumption compared to other RF transmitters using a conventional ring oscillator because the proposed voltage-controlled oscillator (VCO) is operated by ON-/OFF-time of the PWM signal. Moreover, the proposed VCO with a metal-oxide semiconductor switch can reduce the power consumption significantly due to the reduction of idle current loss. The power dissipation of the transmitter is measured as 0.75 mW at a carrier of 315 MHz. The transmission of the modulated signal is performed by the on-chip antenna with bond-wire inductor. The on-chip antenna has gain of -34.33 dBi. The radiated power is measured as -32.3 dBm at a distance of 10 cm between the receiver and the transmitter.
Keywords :
CMOS integrated circuits; MIS devices; UHF antennas; UHF integrated circuits; UHF oscillators; inductors; intelligent sensors; pulse width modulation; radio transmitters; switches; voltage-controlled oscillators; wireless sensor networks; CMOS RF transmitter; PWM method; PWM signal; VCO; bond-wire inductor; distance 10 cm; frequency 315 MHz; idle current loss reduction; metal-oxide semiconductor switch; on-chip antenna; power 0.75 mW; power consumption; power dissipation; pulsewidth modulation method; radiofrequency transmitter; receiver; ring oscillator; voltage-controlled oscillator; wireless smart sensors; Antennas; Inductors; Pulse width modulation; Radio frequency; System-on-a-chip; Transmitters; Voltage-controlled oscillators; Bond-wire inductor; pulsewidth modulation (PWM); radio frequency (RF); transmitter;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2012.2207956
Filename :
6268426
Link To Document :
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