Title :
Modeling of High-Speed Interconnects for Signal Integrity Analysis?? Part I
Author :
Achar, Ramachandra
Author_Institution :
Dept. of Electron., Carleton Univ., Ottawa, ON, Canada
Abstract :
Due to the continually rising demands for high-speed, high-density and broadband applications, signal integrity modeling and analysis has become imperative for design and validation of modern VLSI designs. In this review article, basic concepts of high-speed interconnect modeling were discussed. Also recent advances in interconnect modeling, such as MRA, DEPACT and WR-TP were reviewed.
Keywords :
VLSI; integrated circuit design; integrated circuit interconnections; semiconductor device models; DEPACT; MRA; VLSI design; WR-TP; high-speed interconnects modeling; signal integrity modeling; High speed integrated circuits; High-speed electronics; Interconnected systems; Microelectromechanical systems; Modeling; Quality assessment; Signal processing;
Journal_Title :
Microwave Magazine, IEEE
DOI :
10.1109/MMM.2011.941414
