• DocumentCode
    1266576
  • Title

    Modeling of High-Speed Interconnects for Signal Integrity Analysis?? Part I

  • Author

    Achar, Ramachandra

  • Author_Institution
    Dept. of Electron., Carleton Univ., Ottawa, ON, Canada
  • Volume
    12
  • Issue
    5
  • fYear
    2011
  • Firstpage
    61
  • Lastpage
    74
  • Abstract
    Due to the continually rising demands for high-speed, high-density and broadband applications, signal integrity modeling and analysis has become imperative for design and validation of modern VLSI designs. In this review article, basic concepts of high-speed interconnect modeling were discussed. Also recent advances in interconnect modeling, such as MRA, DEPACT and WR-TP were reviewed.
  • Keywords
    VLSI; integrated circuit design; integrated circuit interconnections; semiconductor device models; DEPACT; MRA; VLSI design; WR-TP; high-speed interconnects modeling; signal integrity modeling; High speed integrated circuits; High-speed electronics; Interconnected systems; Microelectromechanical systems; Modeling; Quality assessment; Signal processing;
  • fLanguage
    English
  • Journal_Title
    Microwave Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    1527-3342
  • Type

    jour

  • DOI
    10.1109/MMM.2011.941414
  • Filename
    5944883
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1266576