Title :
Generalized image method with application to the thermal modeling of power devices and circuits
Author :
Rinaldi, Niccolò
Author_Institution :
Dept. of Electron. & Telecommun. Eng., Univ. of Naples "Federico II", Italy
fDate :
4/1/2002 12:00:00 AM
Abstract :
A new analytical thermal model of multilayer substrates is presented. Based on a generalization of the method of images, the model is straightforward to implement and allows a clearer understanding of the effect of geometric and material parameters on the temperature field. Approximate expressions for the thermal resistance in multilayer substrates are derived for the first time. The generalized image method can be applied to solve similar problems which involve the solution of the Laplace equation in composite domains consisting of several layers. Typical examples are problems of the electrostatics and ohmic conduction phenomena
Keywords :
Laplace equations; circuit simulation; electrostatics; integrated circuit modelling; semiconductor device models; temperature distribution; thermal analysis; thermal resistance; IC modeling; Laplace equation; circuit simulator; composite domains; electrostatics; generalized image method; geometric parameters; material parameters; multilayer substrates; ohmic conduction phenomena; semiconductor device modeling; temperature field; thermal modeling; thermal resistance; Boundary conditions; Circuit simulation; Electrostatics; Integrated circuit modeling; Laplace equations; Nonhomogeneous media; Solid modeling; Substrates; Temperature distribution; Thermal resistance;
Journal_Title :
Electron Devices, IEEE Transactions on
