DocumentCode
1267038
Title
Nitrided Tetragonal
as the Charge-Trapping Layer for Nonvolatile Memory Application
Author
Wu, Yung-Hsien ; Chen, Lun-Lun ; Lin, Yuan-Sheng ; Li, Ming-Yen ; Wu, Hsiao-Che
Author_Institution
Dept. of Eng. & Syst. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume
30
Issue
12
fYear
2009
Firstpage
1290
Lastpage
1292
Abstract
Employment of a tetragonal ZrO2 film as the charge-trapping layer for nonvolatile memory was investigated and the NH3 nitridation effect of the ZrO2 film on memory performance was also explored in this letter. The permittivity of the tetragonal ZrO2 film is slightly reduced from 38.7 to 36.9 after nitridation; nevertheless, nitridation introduces more trapping sites and passivates the grain boundary channel which results in a high operation speed in terms of 2.6-V flatband voltage shift by programming at +10 V for 10 ms and a good retention characteristic with 20.2% charge loss after ten-year operation at 125degC, both are superior to that without NH3 nitridation. Most importantly, the process is fully compatible with existent ULSI technology and paves the way to adopt a high-permittivity crystalline dielectric as the charge-trapping layer for future high-performance nonvolatile memory.
Keywords
ULSI; nitrogen compounds; random-access storage; zirconium compounds; NH3; ULSI technology; ZrO2; charge-trapping layer; nonvolatile memory application; temperature 125 degC; time 10 ms; voltage 10 V; voltage 2.6 V; $hbox{NH}_{3}$ nitridation; Charge trapping layer; Tetragonal $hbox{ZrO}_{2}$ ; grain boundary; nonvolatile memory;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2009.2034115
Filename
5313893
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