DocumentCode
1267195
Title
High-density and alignment-tolerant integration of monitoring photodetector arrays onto polymeric guided-wave components
Author
Van Der Linden, Johan E. ; De Dobbelaere, Peter M. ; Van Daele, Peter P. ; Diemeer, Mart B.
Author_Institution
Eur. Patent Office, Rijswijk, Netherlands
Volume
22
Issue
4
fYear
1999
fDate
11/1/1999 12:00:00 AM
Firstpage
534
Lastpage
540
Abstract
We report on a hybrid integration concept which allows high-density and alignment-tolerant surface mount assembly of top-illuminated photodetector (PD) arrays onto polymeric guided-wave components by means of a micromachined submount with an integrated mirror. This research aims at the development of polymeric waveguide based devices with an embedded optical power monitoring capability for applications in optical fiber communication networks. A prototype integrated multichannel optical power monitor comprising an eight-channel PD module and a polymeric waveguide splitter array was demonstrated which exhibited an average insertion loss of 5.2 dB, a PD coupling efficiency of -2.6 dB, and a crosstalk value of -17.1 dB between adjacent channels. Low polarization and wavelength sensitivity (σ<0.1 dB) was confirmed over a spectral range of 40 nm in both telecom wavelength windows
Keywords
micromachining; monitoring; optical fibre communication; optical receivers; optical switches; photodetectors; surface mount technology; waveguide attenuators; 5.2 dB; adjacent channels; alignment-tolerant integration; coupling efficiency; crosstalk; embedded optical power monitoring capability; high-density integration; insertion loss; integrated mirror; micromachined submount; monitoring photodetector arrays; optical fiber communication networks; polymeric guided-wave components; surface mount assembly; top-illuminated photodetector; waveguide splitter array; wavelength sensitivity; Assembly; Mirrors; Monitoring; Optical arrays; Optical crosstalk; Optical polymers; Optical sensors; Optical surface waves; Optical waveguides; Photodetectors;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/6040.803443
Filename
803443
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