• DocumentCode
    1267215
  • Title

    Optoelectronic/VLSI

  • Author

    Goossen, Keith W.

  • Author_Institution
    Bell Labs., Lucent Technol., Holmdel, NJ, USA
  • Volume
    22
  • Issue
    4
  • fYear
    1999
  • fDate
    11/1/1999 12:00:00 AM
  • Firstpage
    561
  • Lastpage
    567
  • Abstract
    Technology is presented for placing thousands of surface-normal input and output optoelectronic devices onto very large scale integration (VLSI) chips. This enables optical means of bringing information onto and off of an integrated circuit (IC), supplanting electrical means such as wire-bonds
  • Keywords
    VLSI; integrated circuit packaging; integrated optoelectronics; optical interconnections; smart pixels; optical interconnects; smart pixel chips; surface-normal input optoelectronic devices; surface-normal output optoelectronic devices; very large scale integration; Absorption; Excitons; Integrated optics; Optical interconnections; Optical modulation; Optoelectronic devices; Photonic band gap; Photonic integrated circuits; Semiconductor device packaging; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.803446
  • Filename
    803446
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1267215