2.5-Gb/s/ch Long Wavelength Transmitter Modules for Chip-to-Chip Optical PCB Applications

Author

Ukaegbu, Ikechi Augustine ; Kim, Do-Won ; Cho, Mu Hee ; Lee, Tae-Woo ; Park, Hyo-Hoon

Author_Institution

Photonic Comput. Syst. Lab., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea

Volume

23

Issue

19

fYear

2011

Firstpage

1403

Lastpage

1405

Abstract

We have fabricated 2.5-Gb/s/ch long wavelength optical transmitter modules in planar and multichip module structures for chip-to-chip optical printed-circuit board (OPCB) applications. Their performance has been analyzed and compared with two types of short wavelength structures. The long wavelength multichip module showed a 3-dB bandwidth of 2.46 GHz while the planar showed 2.16 GHz. The modules showed clear eye openings at 2.5 Gb/s with a bit-error rate less than 10^-12 and can be used for optical interconnections in OPCBs.

Keywords

error statistics; multichip modules; optical interconnections; optical transmitters; printed circuits; bandwidth 2.16 GHz; bandwidth 2.46 GHz; bit error rate; bit rate 2.5 Gbit/s; chip-to-chip optical PCB; eye openings; long wavelength transmitter modules; multichip module; optical interconnections; Crosstalk; Integrated optics; Optical crosstalk; Optical fibers; Optical interconnections; Optical transmitters; Vertical cavity surface emitting lasers; Flip-chip bonding; long wavelength vertical-cavity surface-emitting laser (VCSEL); optical interconnection; optical printed-circuit board (OPCB); short wavelength VCSEL; silicon complementary metal–oxide–semiconductor (Si-CMOS) driver integrated circuit (IC);

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2011.2161576

Filename

5948330