DocumentCode
1268275
Title
A 1-D Capacitive Micromachined Ultrasonic Transducer Imaging Array Fabricated With a Silicon-Nitride-Based Fusion Process
Author
Logan, Andrew Stephan ; Wong, Lawrence L P ; Yeow, John T W
Author_Institution
Adv. Micro/Nano-Devices Lab., Univ. of Waterloo, Waterloo, ON, Canada
Volume
16
Issue
5
fYear
2011
Firstpage
861
Lastpage
865
Abstract
Capacitive micromachined ultrasonic transducers (CMUTs) are an alternative to the conventional method of generating ultrasound that increases bandwidths, simplifies fabrication, and facilitates the integration with necessary electronics. We report the fabrication, characterization, and initial-phased array imaging results of a 64-element array CMUT fabricated using a fusion bonding process where both the membrane and insulation layers are user deposited silicon nitride. Individual cells have a diameter of 25 μm and a membrane thickness of 500 nm. The center frequency in immersion is 6.6 MHz with a -6 dB fractional bandwidth of 123%. A 90° phased array sector scan is made of a four-wire target using a 32-element subset of the array. Pressures in excess of 2 MPa are measured. An axial resolution of 130 μm and a lateral resolution of 0.03 rad are obtained from a wire target 15 mm away from the transducer.
Keywords
capacitive sensors; micromachining; ultrasonic transducer arrays; 1D capacitive micromachined ultrasonic transducer imaging array; four-wire target; frequency 6.6 MHz; fusion bonding process; phased array sector scan; silicon-nitride-based fusion process; size 25 mum; size 500 nm; Biomedical imaging; Micromachining; Phased arrays; Silicon; Ultrasonic transducer arrays; Capacitive micromachined ultrasonic transducer (CMUT); imaging; phased array; ultrasound;
fLanguage
English
Journal_Title
Mechatronics, IEEE/ASME Transactions on
Publisher
ieee
ISSN
1083-4435
Type
jour
DOI
10.1109/TMECH.2011.2159732
Filename
5948383
Link To Document