DocumentCode
1271148
Title
Simulation study on comparison between metal gate and polysilicon gate for sub-quarter-micron MOSFETs
Author
Abe, Yuji ; Oishi, Toshiyuki ; Shiozawa, Katsuomi ; Tokuda, Yasunori ; Satoh, Shinichi
Author_Institution
Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan
Volume
20
Issue
12
fYear
1999
Firstpage
632
Lastpage
634
Abstract
Two-dimensional (2-D) process and device simulation is used to investigate the effectiveness of the depletion-free metal gate for a sub-quarter-micron MOSFET as compared with surface channel polysilicon gate MOSFETs which suffer greatly from the gate depletion effect. The results reveal that the subthreshold characteristic for the metal gate NMOSFET is considerably degraded since the depletion-free merit is covered up by an undesirable influence of the buried channel structure, which is indispensable to obtain an appropriate threshold voltage for the midgap gate. Consequently, the drivability of the metal gate MOSFET is comparable to that of the heavily doped polysilicon gate MOSFET under commonly used conditions, and further, the metal gate structure is disadvantaged against the reduction of the supply voltage.
Keywords
MOSFET; buried layers; doping profiles; semiconductor device models; silicon; 2D device simulation; Si; buried channel structure influence; depletion-free metal gate; drift diffusion model; drivability; gate depletion effect; heavily doped polysilicon gate; sub-quarter-micron MOSFET; subthreshold characteristic; surface channel polysilicon gate; threshold voltage; Capacitance; Degradation; Doping; Impurities; MOSFET circuits; Silicon; Threshold voltage; Titanium; Tungsten; Two dimensional displays;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.806111
Filename
806111
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