• DocumentCode
    1271148
  • Title

    Simulation study on comparison between metal gate and polysilicon gate for sub-quarter-micron MOSFETs

  • Author

    Abe, Yuji ; Oishi, Toshiyuki ; Shiozawa, Katsuomi ; Tokuda, Yasunori ; Satoh, Shinichi

  • Author_Institution
    Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan
  • Volume
    20
  • Issue
    12
  • fYear
    1999
  • Firstpage
    632
  • Lastpage
    634
  • Abstract
    Two-dimensional (2-D) process and device simulation is used to investigate the effectiveness of the depletion-free metal gate for a sub-quarter-micron MOSFET as compared with surface channel polysilicon gate MOSFETs which suffer greatly from the gate depletion effect. The results reveal that the subthreshold characteristic for the metal gate NMOSFET is considerably degraded since the depletion-free merit is covered up by an undesirable influence of the buried channel structure, which is indispensable to obtain an appropriate threshold voltage for the midgap gate. Consequently, the drivability of the metal gate MOSFET is comparable to that of the heavily doped polysilicon gate MOSFET under commonly used conditions, and further, the metal gate structure is disadvantaged against the reduction of the supply voltage.
  • Keywords
    MOSFET; buried layers; doping profiles; semiconductor device models; silicon; 2D device simulation; Si; buried channel structure influence; depletion-free metal gate; drift diffusion model; drivability; gate depletion effect; heavily doped polysilicon gate; sub-quarter-micron MOSFET; subthreshold characteristic; surface channel polysilicon gate; threshold voltage; Capacitance; Degradation; Doping; Impurities; MOSFET circuits; Silicon; Threshold voltage; Titanium; Tungsten; Two dimensional displays;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.806111
  • Filename
    806111