DocumentCode :
1271148
Title :
Simulation study on comparison between metal gate and polysilicon gate for sub-quarter-micron MOSFETs
Author :
Abe, Yuji ; Oishi, Toshiyuki ; Shiozawa, Katsuomi ; Tokuda, Yasunori ; Satoh, Shinichi
Author_Institution :
Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan
Volume :
20
Issue :
12
fYear :
1999
Firstpage :
632
Lastpage :
634
Abstract :
Two-dimensional (2-D) process and device simulation is used to investigate the effectiveness of the depletion-free metal gate for a sub-quarter-micron MOSFET as compared with surface channel polysilicon gate MOSFETs which suffer greatly from the gate depletion effect. The results reveal that the subthreshold characteristic for the metal gate NMOSFET is considerably degraded since the depletion-free merit is covered up by an undesirable influence of the buried channel structure, which is indispensable to obtain an appropriate threshold voltage for the midgap gate. Consequently, the drivability of the metal gate MOSFET is comparable to that of the heavily doped polysilicon gate MOSFET under commonly used conditions, and further, the metal gate structure is disadvantaged against the reduction of the supply voltage.
Keywords :
MOSFET; buried layers; doping profiles; semiconductor device models; silicon; 2D device simulation; Si; buried channel structure influence; depletion-free metal gate; drift diffusion model; drivability; gate depletion effect; heavily doped polysilicon gate; sub-quarter-micron MOSFET; subthreshold characteristic; surface channel polysilicon gate; threshold voltage; Capacitance; Degradation; Doping; Impurities; MOSFET circuits; Silicon; Threshold voltage; Titanium; Tungsten; Two dimensional displays;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.806111
Filename :
806111
Link To Document :
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