• DocumentCode
    1271325
  • Title

    A Novel Ion-Bombarded and Plasma-Passivated Charge Storage Layer for SONOS-Type Nonvolatile Memory

  • Author

    Liu, Sheng-Hsien ; Yang, Wen-Luh ; Wu, Chi-Chang ; Chao, Tien-Sheng

  • Author_Institution
    Program of Electr. & Commun. Eng., Feng Chia Univ., Taichung, Taiwan
  • Volume
    33
  • Issue
    10
  • fYear
    2012
  • Firstpage
    1393
  • Lastpage
    1395
  • Abstract
    A novel technique combination of ion bombardment (IB) and NH3 plasma treatment (PT) has been presented to yield a highly effective charge storage layer for Si/SiO2/Si3N4/SiO2/Si (SONOS)-type nonvolatile memory applications. The IB technique creates additional trap sites within the charge storage layer strikingly to enhance the charge trapping/detrapping efficiency of the storage layer, and the NH3 PT passivates shallow trap sites significantly to improve reliability characteristics. The distribution of trap sites corresponding with various energy levels is clearly described by discharge-based multipulse analysis. As compared with the control sample (without IB and NH3 PT), the ion-bombarded and NH3-plasma-passivated memory device has faster program/erase speeds and larger memory window. In addition, the competent reliability properties of the ion-bombarded and NH3-plasma-passivated memory, such as good endurance, long data retention, and acceptable disturbance, were also demonstrated in this letter.
  • Keywords
    ammonia; plasma devices; random-access storage; silicon; silicon compounds; IB technique; NH3; SONOS-type nonvolatile memory; Si-SiO2-Si3-N4-SiO2-Si; charge trapping-detrapping efficiency enhancement; competent reliability properties; control sample; discharge-based multipulse analysis; ion-bombarded charge storage layer; ion-bombarded memory device; memory window; plasma treatment; plasma-passivated charge storage layer; plasma-passivated memory device; program-erase speeds; trap site distribution; Charge carrier processes; Energy states; Flash memory; Nonvolatile memory; Plasmas; Reliability; Silicon; $hbox{NH}_{3}$ plasma treatment (PT); Discharge-based multipulse (DMP); Flash memory; ion bombardment (IB); metal/Al2O3/Si3N4/SiO2/Si (MANOS);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2012.2207699
  • Filename
    6280616