• DocumentCode
    1271591
  • Title

    Design and Modeling of a Miniaturized Substrate Integrated Waveguide Using Embedded SRRs

  • Author

    Farzami, Farhad ; Forooraghi, Keyvan ; Norooziarab, Majid

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Tarbiat Modares Univ., Tehran, Iran
  • Volume
    10
  • fYear
    2011
  • fDate
    7/3/1905 12:00:00 AM
  • Firstpage
    713
  • Lastpage
    716
  • Abstract
    A substrate integrated waveguide (SIW) loaded by embedded split-ring resonators (SRRs) with transversal negative effective permeability is proposed. It is shown that the structure can support propagation of backward waves below cutoff frequency. Therefore, the width of the SIW structure can be considered less than half a wavelength at the cutoff frequency, which means that the SIW structure is miniaturized. In this letter, design and modeling of a miniaturized SIW structure is proposed. An experimental SIW loaded with double embedded SRRs in 4.75-GHz frequency band has been designed, fabricated, and tested. The measured and simulated results show a passband for backward waves below the cutoff frequency. It is also shown that the phase at a certain frequency in the backward passband increases as the physical length of the loaded SIW is increased (opposite to forward wave propagation), which proves that backward waves propagate below the cutoff frequency.
  • Keywords
    microwave resonators; substrate integrated waveguides; SIW structure; backward passband; backward wave propagation; cutoff frequency; embedded SRR; embedded split ring resonator; frequency 4.75 GHz; miniaturized substrate integrated waveguide design; miniaturized substrate integrated waveguide modeling; transversal negative effective permeability; Cutoff frequency; Load modeling; Passband; Permeability; Rectangular waveguides; Resonant frequency; Substrates; Backward waves; embedded split-ring resonator (SRR); substrate integrated waveguide (SIW);
  • fLanguage
    English
  • Journal_Title
    Antennas and Wireless Propagation Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1536-1225
  • Type

    jour

  • DOI
    10.1109/LAWP.2011.2161860
  • Filename
    5953466