DocumentCode :
1272605
Title :
Curvilinear detailed routing with simultaneous wire-spreading and wire-fattening
Author :
Hama, Toshiyuki ; Etoh, Hiroaki
Author_Institution :
IBM Res., IBM Japan Ltd., Kanagawa, Japan
Volume :
18
Issue :
11
fYear :
1999
fDate :
11/1/1999 12:00:00 AM
Firstpage :
1646
Lastpage :
1653
Abstract :
This paper describes an algorithm for curvilinear detailed routing. We significantly improved the average time performance of Gao´s algorithm by resolving its bottleneck related to generation of fan-shaped forbidden regions along a wire. We also describe a method for simultaneous wire-spreading and wire-fattening, which consists of enlarging forbidden regions generated by the detailed routing algorithm as long as there remains any space through which wires can pass. From the experiments we obtained the result that the average CPU time of the detailed routing algorithm is almost linear to the length of a wire. Since the curvilinear detailed routing is efficient in terms of space usage, the proposed algorithm is important especially for densely wired printed circuit boards such as pin grid array packages, ball grid array packages, and multichip modules. We can also expect improvements on the electrical characteristics and the production yield by applying wire-spreading and wire-fattening to them
Keywords :
ball grid arrays; circuit layout CAD; integrated circuit packaging; multichip modules; network routing; printed circuit layout; BGA packages; MCM; PGA packages; ball grid array packages; curvilinear detailed routing; densely wired PCB; electrical characteristics; fan-shaped forbidden regions; multichip modules; pin grid array packages; printed circuit boards; production yield; simultaneous wire spreading/fattening; wire-fattening; wire-spreading; Electric variables; Electronics packaging; Euclidean distance; Multichip modules; Printed circuits; Production; Routing; Topology; Wires; Wiring;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.806809
Filename :
806809
Link To Document :
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