• DocumentCode
    1272605
  • Title

    Curvilinear detailed routing with simultaneous wire-spreading and wire-fattening

  • Author

    Hama, Toshiyuki ; Etoh, Hiroaki

  • Author_Institution
    IBM Res., IBM Japan Ltd., Kanagawa, Japan
  • Volume
    18
  • Issue
    11
  • fYear
    1999
  • fDate
    11/1/1999 12:00:00 AM
  • Firstpage
    1646
  • Lastpage
    1653
  • Abstract
    This paper describes an algorithm for curvilinear detailed routing. We significantly improved the average time performance of Gao´s algorithm by resolving its bottleneck related to generation of fan-shaped forbidden regions along a wire. We also describe a method for simultaneous wire-spreading and wire-fattening, which consists of enlarging forbidden regions generated by the detailed routing algorithm as long as there remains any space through which wires can pass. From the experiments we obtained the result that the average CPU time of the detailed routing algorithm is almost linear to the length of a wire. Since the curvilinear detailed routing is efficient in terms of space usage, the proposed algorithm is important especially for densely wired printed circuit boards such as pin grid array packages, ball grid array packages, and multichip modules. We can also expect improvements on the electrical characteristics and the production yield by applying wire-spreading and wire-fattening to them
  • Keywords
    ball grid arrays; circuit layout CAD; integrated circuit packaging; multichip modules; network routing; printed circuit layout; BGA packages; MCM; PGA packages; ball grid array packages; curvilinear detailed routing; densely wired PCB; electrical characteristics; fan-shaped forbidden regions; multichip modules; pin grid array packages; printed circuit boards; production yield; simultaneous wire spreading/fattening; wire-fattening; wire-spreading; Electric variables; Electronics packaging; Euclidean distance; Multichip modules; Printed circuits; Production; Routing; Topology; Wires; Wiring;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/43.806809
  • Filename
    806809