• DocumentCode
    1273278
  • Title

    Three-Dimensional Stacked Multilayer Graphene Interconnects

  • Author

    Yu, Tianhua ; Liang, Chen-Wei ; Kim, Changdong ; Song, Eui-Sang ; Yu, Bin

  • Author_Institution
    Coll. of Nanoscale Sci. & Eng., State Univ. of New York, Albany, NY, USA
  • Volume
    32
  • Issue
    8
  • fYear
    2011
  • Firstpage
    1110
  • Lastpage
    1112
  • Abstract
    We experimentally demonstrate stacked multilayer graphene (MLG) (s-MLG) as a new material system for high-performance carbon interconnects. Electrical performance is systematically characterized. We discover that the wire sheet resistance of s-MLG decreases with more layers stacking and shows better conductivity than that of the exfoliated MLG sample with the same layer numbers. The contact resistance of the s-MLG samples was calculated and confirmed using two different methods. It is demonstrated that a decrease in the intrinsic resistivity of s-MLG with increasing layer number is discovered; however, contact resistance will be saturated with more stacked layer numbers.
  • Keywords
    contact resistance; electrical conductivity; electrical resistivity; graphene; integrated circuit interconnections; multilayers; conductivity; contact resistance; electrical performance; high-performance carbon interconnects; intrinsic resistivity; material system; s-MLG; three-dimensional stacked multilayer graphene interconnects; wire sheet resistance; Conductivity; Contact resistance; Copper; Electrical resistance measurement; Nonhomogeneous media; Resistance; Wires; Contact resistivity; interconnect; sheet resistance; stacked multilayer graphene (s-MLG);
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2011.2158385
  • Filename
    5954153