• DocumentCode
    1273417
  • Title

    Defining Material Parameters in Commercial EM Solvers for Arbitrary Metal-Based THz Structures

  • Author

    Episkopou, Elpida ; Papantonis, Stergios ; Otter, William J. ; Lucyszyn, Stepan

  • Author_Institution
    Centre for Terahertz Sci. & Eng., Imperial Coll. London, London, UK
  • Volume
    2
  • Issue
    5
  • fYear
    2012
  • Firstpage
    513
  • Lastpage
    524
  • Abstract
    Frequency-domain solvers are used extensively for modeling arbitrary metal-based terahertz structures. Four well-known commercially available electromagnetic (EM) modeling software packages include HFSS™, CST Microwave Studio®, EMPro, and RSoft. However, there are a number of operational issues that relate to how they can be used to obtain more meaningful and accurate results. Even experienced users of these and similar software packages may not fully appreciate some of the subtle ambiguities in defining boundaries and material parameters for use in THz applications. To this end, a detailed comparative study has been undertaken, in consultation with all four vendors. First, in order to avoid introducing ambiguities, frequency dispersion in materials has to be clearly defined from first principles; in both intrinsic and effective forms. Different frequency dispersion models are then introduced for `metal-like´ materials. To act as benchmark structures, conventional air-filled metal-pipe rectangular waveguides, associated cavity resonators and a spoof surface plasmon waveguide have been simulated, using a raft of different approaches; with a view to illustrating quantifiable weaknesses in commercial software packages for simulating arbitrary metal-based THz structures. This paper highlights intuitive and logical approaches that give incorrect results and, where possible, makes recommendations for the most appropriate solutions that have hitherto not been given in Technical Notes.
  • Keywords
    frequency-domain analysis; resonators; surface plasmons; terahertz materials; waveguides; CST Microwave Studio package; EMPro package; HFSS package; RSoft package; benchmark structure; cavity resonator; commercial EM solvers; electromagnetic modeling software package; frequency dispersion; frequency domain solvers; material parameter; metal based THz structure; operational issues; spoof surface plasmon waveguide; Conductivity; Dispersion; Impedance; Materials; Mathematical model; Metals; Surface impedance; Cavity resonators; commercial software; frequency domain; metal; numerical modeling; terahertz (THz); waveguides;
  • fLanguage
    English
  • Journal_Title
    Terahertz Science and Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-342X
  • Type

    jour

  • DOI
    10.1109/TTHZ.2012.2208456
  • Filename
    6287043