DocumentCode
1275126
Title
Ultrabroad-band vertical transition for multilayer integrated circuits
Author
Zhu, Lei ; Wu, Ke
Author_Institution
Dept. of Electr. & Comput. Eng., Montreal Univ., Que., Canada
Volume
9
Issue
11
fYear
1999
fDate
11/1/1999 12:00:00 AM
Firstpage
453
Lastpage
455
Abstract
A vertical transition using wide-aperture coupling is proposed for ultrabroad-band design of multilayer integrated circuits. With an electrically wide aperture formed on the common ground plane of two-layered microstrip line structures, a significant enhancement of capacitively series coupling is observed at low frequency. This simple technique realizes a very flat frequency response of transmission over a very broad bandwidth. A two-layered transition is accurately characterized by applying a so-called “short-open calibration” (SOC) scheme to calibrate numerical results obtained from a full-wave method of moments (MoM). The transition shows several attractive features such as ultrabroad bandwidth, low radiation loss, and deep up-band rejection. Predictions are verified by measurements over a wide frequency range
Keywords
MMIC; calibration; frequency response; integrated circuit design; method of moments; microstrip lines; MMICs; capacitively series coupling; electrically wide aperture; flat frequency response; full-wave method of moments; multilayer integrated circuits; radiation loss; short-open calibration; two-layered microstrip line structures; two-layered transition; ultrabroad-band vertical transition; up-band rejection; wide-aperture coupling; Apertures; Bandwidth; Coupling circuits; Frequency measurement; Integrated circuit interconnections; MMICs; Microstrip; Microwave integrated circuits; Moment methods; Nonhomogeneous media;
fLanguage
English
Journal_Title
Microwave and Guided Wave Letters, IEEE
Publisher
ieee
ISSN
1051-8207
Type
jour
DOI
10.1109/75.808032
Filename
808032
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