Title :
Fabrication of 150-nm T-Gate Metamorphic AlInAs/GaInAs HEMTs on GaAs Substrates by MOCVD
Author :
Li, Haiou ; Feng, Zhihong ; Tang, Chak Wah ; Lau, Kei May
Author_Institution :
Sch. of Inf. & Commun., Guilin Univ. of Electron. Technol., Guilin, China
Abstract :
Metamorphic AlInAs/GaInAs high-electron-mobility transistors (HEMTs) of 150-nm gate length with very good device performance have been grown by metal-organic chemical vapor deposition, with the introduction of an effective multistage buffering scheme. By using a combined optical and e-beam photolithography technology, submicrometer mHEMT devices have been achieved. The devices exhibit good dc and RF performance. The maximum transconductance was 1074 mS/mm. The nonalloyed ohmic contact resistance Rc was as low as 0.02 Ω·mm. The unity current gain cutoff frequency (fT) and the maximum oscillation frequency (fmax) were 279 and 231 GHz, respectively. This device has the highest fT yet reported for 150-nm gate-length HEMTs. Also, an input capacitance to gate-drain feedback capacitance ratio Cgs/Cgd of 3.2 is obtained in the device.
Keywords :
III-V semiconductors; MOCVD; aluminium compounds; capacitance; contact resistance; electron beam lithography; feedback; gallium arsenide; high electron mobility transistors; indium compounds; millimetre wave field effect transistors; ohmic contacts; photolithography; AlInAs-GaInAs; GaAs; MOCVD; RF performance; T-gate metamorphic HEMT fabrication; dc performance; electron beam photolithography; gate-drain feedback capacitance; high electron mobility transistor; metal organic chemical vapor deposition; multistage buffering scheme; nonalloyed ohmic contact resistance; optical photolithography; oscillation frequency; size 150 nm; submicrometer mHEMT device; transconductance; unity current gain cutoff frequency; Gallium arsenide; Logic gates; MOCVD; MODFETs; Substrates; mHEMTs; AlInAs/GaInAs; GaAs; metal–organic chemical vapor deposition (MOCVD); metamorphic high-electron-mobility transistors (mHEMTs);
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2011.2159824