DocumentCode
1276861
Title
Prognostics of Multilayer Ceramic Capacitors Via the Parameter Residuals
Author
Sun, Jianzhong ; Cheng, Shunfeng ; Pecht, Michael
Author_Institution
Nanjing Univ. of Aeronaut. & Astronaut., Nanjing, China
Volume
12
Issue
1
fYear
2012
fDate
3/1/2012 12:00:00 AM
Firstpage
49
Lastpage
57
Abstract
This paper presents a parameter residual-based method for predicting the remaining useful life (RUL) of multilayer ceramic capacitors (MLCCs) under temperature-humidity-bias conditions. Three performance parameters in each MLCC were monitored: capacitance, dissipation factor, and insulation resistance. A kernel regression method was used to estimate the parameters´ values of interest. The residuals were generated by the difference between the estimation and the actual monitored value. Based on the features of the residual data, a linear state space model was adopted to describe the dynamics of the residuals. The future evolution of the residuals was predicted with uncertainty bounds in a Bayesian framework. The failure threshold in terms of the parameter residuals was investigated. Then, the RUL of each MLCC with uncertainty bounds was determined. By comparing the predicted results with the experimental results, it was demonstrated that the proposed prognostics approach can provide an estimation of the RUL of MLCCs.
Keywords
Bayes methods; ceramic capacitors; failure analysis; regression analysis; remaining life assessment; Bayesian framework; MLCC prognostics; RUL prediction; capacitance; dissipation factor; failure threshold; insulation resistance; kernel regression method; linear state space model; multilayer ceramic capacitor prognostics; parameter residual-based method; remaining-useful life prediction; temperature-humidity-bias conditions; uncertainty bounds; Capacitance; Degradation; Equations; Kernel; Mathematical model; Temperature measurement; Training; Kernel regression; multilayer ceramic capacitors (MLCCs); parameter residual; prognostics; state space model;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2011.2162517
Filename
5958588
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