Title :
A 120-W X-band spatially combined solid-state amplifier
Author :
Cheng, Nai-Shuo ; Jia, Pengcheng ; Rensch, David B. ; York, Robert A.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
fDate :
12/1/1999 12:00:00 AM
Abstract :
In this paper, we present new results in the development of a broad-band spatial power-combining system implemented in a standard X-band waveguide environment. Using 24 off-the-shelf GaAs monolithic-microwave integrated-circuit (MMIC) power amplifiers integrated with tapered-slot antenna arrays, the new combining circuit produced up to 126-W maximum power output with a gain variation of ±1.9 dB within the band of interest (8-11 GHz). This hybrid circuit combiner is transparent to the device technology, and also provides an excellent heat-sinking capacity, sustaining as much as 415 W of dc power consumed by the MMIC amplifiers. The modular architecture allows easy maintenance, variable output power level, and modular assembly. Results on graceful degradation are also presented, showing superb tolerance to device failure
Keywords :
MMIC power amplifiers; fin line components; heat sinks; hybrid integrated circuits; microstrip transitions; power combiners; slot antenna arrays; thermal management (packaging); 126 W; 8 to 11 GHz; GaAs; GaAs MMIC power amplifiers; X-band spatially combined solid-state amplifier; X-band waveguide environment; broad-band spatial power-combining system; dc power; device failure tolerance; finline structure; gain variation; graceful degradation; heat-sinking capacity; hybrid circuit combiner; maximum power output; modular architecture; modular assembly; slotline-to-microstrip transition; tapered-slot antenna arrays; variable output power level; Antenna arrays; Assembly; Cogeneration; Gallium arsenide; Integrated circuit technology; MMICs; Power amplifiers; Power generation; Solid state circuits; Standards development;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
