Corrections to “Copper Anisotropy Effects in Three-Dimensional Integrated Circuits Using Through-Silicon Vias” [Jun 12 225-232]

Author

Karmarkar, Aditya P. ; Xu, Xin ; Yeap, Kong-Boon ; Zschech, E.

Author_Institution

Synopsys (India) Private Ltd., Hyderabad, India

Volume

Issue

fYear

2012

Firstpage

582

Lastpage

582

Abstract

In the above titled paper (ibid., vol. 12, no. 2, pp. 225-232, June 2012), Fig. 1 did not appear correctly. The corrected Fig. 1 is presented here.

Keywords

Charge carrier mobility; Copper; Integrated circuit reliability; Three-dimensional integrated circuits; Through-silicon vias;

fLanguage

English

Journal_Title

Device and Materials Reliability, IEEE Transactions on

Publisher

ieee

ISSN

1530-4388

Type

DOI

10.1109/TDMR.2012.2209531

Filename

6291836

Link To Document